Thermal applications

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| Thermal applications

A diamond by far surpasses its main competitors: silicon (Si), silicon-carbide (SiC) and gallium-nitride (GaN) in thermal conductivity. Thermal conductivity of diamond plates is ranging from 1000 至 2000 W/mK, 然而, due to unique technology our single-crystal subs have shown better results averaging approx. 2100 W/mK.

Hydray diamond is able to fully remove the heat or to change temperature of high-power sources in order to prevent overheating, damage and destruction of the working module. Diamond heat sink substrates allow to increase capacity of the operating modules and their life time in extreme conditions. It is very important for semiconductor industry, in wich currently it is not possible to develop UHP and fast processors and it stays only a dream of a technologist at this stage and time.

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| 生產

我們積極開發珠寶, 工業和科學國際市場部門. 我們探索創新方法和技術來提高實驗室培育鑽石原石的質量. 公司專注於與國際研究機構和創新公司合作,建立互利合作的主要目的 - 貢獻整個 Lab Grown Diamonds 原石市場.

POLISHED DIAMOND

large sizes 1.0 - 10.0 ct

colorless and fancy blue

different shapes and clarity

DIAMOND PLATES

2.5 x 2.5 - 15.0 x 15.0 毫米

multi- and mono-sectorial

IIa and IIb types

DIAMOND ANVILS

diameter 2.60 - 4.15 毫米

smooth and faceted

取決於 100 GPa

DIAMOND LENSES

Lenses for spectrometers

X-Ray refractive lenses

Intraocular (IOL)

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